If You Want To Get Ahead, Get A Patent

Tight Spacing & High Precision Pad Location

Tong Hsing, a patented company (Patent No.: US 6,800,211 B2) invented a method for removing voids in a ceramic substrate, and more particularly a method including a chemical copper plating process after a sputtering titanium/copper step. The chemical copper plating step is able to successfully and electrically communicate both sides of the ceramic substrate so that when the copper pattern is formed on both sides of the ceramic substrate, communication is established.

Conventional leads of printed circuit ceramic substrates are made through a special metal mask in a vacuum environment by sputtering technology or evaporating technology. Because the leads are very thin and some oxide or nitride is mixed in the leads, it is necessary to use the ceramic substrate with high flatness, and an alumina material purity of 99.6%. For the above reason, the cost of the fabrication is very high. For another conventional process of printed circuit ceramic substrates, the cost is low, but the flatness of the circuit is not satisfactory to reach the requirement of a high frequency circuit. The best width of the leads and width between each lead is 6 mil. For high frequency circuits. This process can not meet the requirements thereof. Furthermore, while preparing a ceramic substrate, titanium/copper sputtering is employed to communicate both sides of the substrate. However, because there are holes defined in the ceramic substrate, and if the dimension of some of the holes is smaller than 100u, the process of sputtering can not ensure that all the holes are covered with a layer of titanium/copper so that when the pattern is formed on the substrate, communication between both sides of the ceramic substrate is not satisfactory. Therefore, it is an objective of the invention to provide an improved method to solve these problems.

In conclusion, the method for forming a high frequency, high power semiconductor module in accordance with the present invention integrates the advantages of the respective thin-film and thick-film processes through two stages, whereby the semiconductor module can simultaneously possess resistors with high impedance and precise circuits.

Method for removing voids in a ceramic substrate

Due to Tong Hsing’s sophisticated technology, they have lower the LED operating temperatures which means longer lifetime of the devices.

How big is the company? Tong Hsing services clients internationlly from Taiwan, U.S., Europe to all over the world, and 60% of them are in the U.S.; meaning wherever you go, you see Tong Hsing's products. Their product range is wide and includes high brightness LEDs, power semiconductors, RF and microwave devices, and dense memory stacks.

For the past several years, HB-LED market has mostly been dominated by several companies. However, the situation has recently changed. Tong Hsing has successfully established a corporate relationship with leading LED lighting companies globally.

From left to right: Blank Substrate, Squttering, Dry Film Lamination, Developing, Ni Plating, Au Plating, Stripping, Etching

Know more about this excellent DPC(Direct Plated Copper) metallized substrate maker -- Tong Hsing.

Direct Bonded Copper

DBC Properties and Parameters

DBC Design Guideline

DPC Design Rule

Copper Thermal for DPC Metallized Ceramic

Pull Test of DPC

DPC(Direct Plated Copper) Patent

Substrates for solar concentrator cells

Search Related Products