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Better Heat dissipation; Longer lifetime

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DPC (Direct Plated Copper)Metallized Substrate

Why DPC Metallized Substrate?

- It was created to replace DBC (Direct Bonded Copper) because of their better electrical, thermal and mechanical performance, in addition, it has the advantage of lower cost potential.

Important Factors for an excellent Metallized Substrate

Heat dissipation of the Metallized Substrate(DPC)

Heat generated by electronic circuitry must be dissipated to prevent immediate failure and improve long term reliability, therefore thermal management is critical. Many of today's hottest and most promising fields depend on metallized ceramics. For example, effective heat dissipation ensuring the long life of an LED product and it depends on effectively controlling the operating temperature of the LEDs. Put simply: Controlled conduction of heat means not only increased life time but equally stabilizes the LED’s color. Getting rid of the heat offers is another important advantage: A high luminous flux.

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Size of DPC Metallized Substrate

Miniaturization of electric and electronic instruments depends largely the high packaging density of the circuit. A metallized ceramic capacitor has the advantages of small size, meaning a large capacitance is obtained in a small size of capacitor, the high density of mounting on a printed circuit board is possible by bonding the chip capacitor on a flat conductive pattern. The microelectronics industry commonly uses ceramic or glass monolythic chip capacitors for printed circuit board construction.

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DPC(Direct Plated Copper) Substrate

How to make DPC Substrate?

Key Attributes of DPC

Unsurpassed thermal performance

Low electrical resistance conductor lines

Stable up to temperature > 340°C

Accurate feature location, compatible with automated, large format assembly.

Fine line resolution allowing high density of devices and circuitry.

Proven reliability

Mechanically rugged ceramic construction.

Lowest cost, highest performance ceramic solution.

Proprietary Bonding Layer

A number of tests confirm the overall DPC performance has been found to be equivalent or superior to conventional thick film. Adhesion of conductors is excellent and, when using a nail head pull test, it is normal for neither the wire or ceramic to break, even after aging at 150°C.