Smaller, Thinner thin film, thick film design. 

DPC (Direct Plated Copper)Metallized Substrate

Why DPC Metallized Substrate?

- It was created to replace DBC (Direct Bonded Copper) because of their better electrical, thermal and mechanical performance, in addition, it has the advantage of lower cost potential.

Important Factors for an excellent Metallized Substrate

• Heat dissipation of the Metallized Substrate(DPC)

Heat generated by electronic circuitry must be dissipated to prevent immediate failure and improve long term reliability, therefore thermal management is critical. Many of today's hottest and most promising fields depend on metallized ceramics. For example, effective heat dissipation ensuring the long life of an LED product and it depends on effectively controlling the operating temperature of the LEDs. Put simply: Controlled conduction of heat means not only increased life time but equally stabilizes the LED’s color. Getting rid of the heat offers is another important advantage: A high luminous flux.

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• Size of DPC Metallized Substrate

Miniaturization of electric and electronic instruments depends largely the high packaging density of the circuit. A metallized ceramic capacitor has the advantages of small size, meaning a large capacitance is obtained in a small size of capacitor, the high density of mounting on a printed circuit board is possible by bonding the chip capacitor on a flat conductive pattern. The microelectronics industry commonly uses ceramic or glass monolythic chip capacitors for printed circuit board construction.

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          DPC(Direct Plated Copper) Substrate

How to make DPC Substrate?

Key Attributes of Copper Plating

• Unsurpassed thermal performance

• Low electrical resistance conductor lines

• Stable up to temperature > 340°C

• Accurate feature location, compatible with automated, large format assembly.

• Fine line resolution allowing high density of devices and circuitry.

• Proven reliability

• Mechanically rugged ceramic construction.

• Lowest cost, highest performance ceramic solution.

Proprietary Bonding Layer

A number of tests confirm the overall DPC performance has been found to be equivalent or superior to conventional thick film. Adhesion of conductors is excellent and, when using a nail head pull test, it is normal for neither the wire or ceramic to break, even after aging at 150°C.

DPC Substrate

Comparison of DPC to other Technologies

Comparison of DPC to DBC

Comparison of Thin Film to Thick Film

Summary

Overall, copper plating perfoms superior compared to other technologies in terms of its features and applications.

DPC Features:
• Higher circuit density
• Outstanding high-frequency characteristics
• Excellent thermal management and heat-transfer performance
• Outstanding solderability and wire-bonding assembly characteristics
• Low tooling costs and quick turnaround of prototypes

Applications of DPC:
• HBLED
• Substrates for solar concentrator cells
• Power semiconductor packaging including automotive motor control
• Hybrid and electric automobile power management electronics
• Packages for RF
• Microwave devices

A World Class DPC Manufacturer - Tong Hsing

Tong Hsing Electronic Industries Limited is a world leader that has been specialized in providing micro module foundry services since 1975. Their products and services including:

• RF Modules for Cellular Handsets, WLAN, and WiMax
• SiP Packaging for WLAN, UWB, and PAN
• MEMS Packaging
• Image Sensor Packaging
• PCB assembly with SMT and/or COB Processes
• Automotive
• Ceramic Thick Film/Thin Film Substrate Fabrication

Direct Bonded Copper

DBC Properties and Parameters

DBC Design Guideline

DPC Design Rule

Copper Thermal for DPC Metallized Ceramic

Pull Test of DPC

DPC(Direct Plated Copper) Patent

Substrates for solar concentrator cells

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